In Virtual Reality News
May 9, 2022 – Spectra7 Microsystems Inc., a provider of high-performance analog semiconductor products for data centers, 5G infrastructure, virtual and augmented reality (VR/AR), and other connectivity markets, has recently announced that it has entered production of a significant design win previously awarded by a major consumer game VR platform provider, although the company did not name which VR platform provider it was.
Spectra7 stated that its advanced ‘DreamWeVR’ chipset of three chips will be used in the tethered interconnect between the game platform and the VR head mounted display (HMD). The company also added that it has worked with the customer to secure raw materials and production capacity aligned to the intended delivery schedule of the DreamWeVR chips.
“We are extremely pleased that our DreamWeVR chipset was chosen by this global tier-one game platform maker for their second-generation VR headset,” said Spectra7 CEO, Raouf Halim. “We have worked closely with them and their cable partners for several years to bring this win to fruition. Initial production shipments of our chipset have started and will continue to ramp throughout the duration of this program, which we anticipate will be over multiple years.”
Spectra7 noted that while today’s VR experiences are increasingly immersive, next generation systems promise to deliver significantly lighter weight, higher performance and dramatically higher bandwidth feeding next generation ultra-high-resolution multi-display systems.
According to Spectra7, each of the chips used in the tethered interconnect feature the company’s ‘SpectraLinear EQ’ architecture that builds on previous advanced patented analog equalization technology developed by the company, while incorporating a high linearity output driver that works in a collaborative way with device systems-on-a-chip (SOC) and enables the highest total link performance.
Spectra7’s DreamWeVR chips support 4K HDR at frame rates up to 120Hz and multi-camera tracking data being sent back to the platform. The Spectra7 chips are also ultra-low power and packaged in tiny chip scale packages, allowing them to be embedded in slim Type-C connectors.
For more information on Spectra7 and its DreamWeVR chips for use in virtual and augmented reality devices, please visit the company’s website.
Image credit: Spectra7