Qualcomm’s Snapdragon 888 runs pretty hot, even wildly under certain circumstances on some phones. In contrast, the Snapdragon 865/865 + / 870 family does not have this problem. If you expected the next generation of high-end chipsets from Qualcomm to be cooler than the 888, well, you might be surprised.
According to a rumor from China, the first tests of samples using Samsung’s 4nm lithography show a 20% improvement in the performance of the next chip, which bears the model number SM8450 and may be called Snapdragon 895 or 898. .. or who knows what else. For sanity reasons we’ll call it 895, but that doesn’t mean we know for sure that’s what it will end up being named.
While this performance improvement (supposedly compared to the 888 or 888+) is obviously a welcome development, there is a flip side to this coin, and that is that the new chip heats up too. We unfortunately don’t have more details, and this is the first sample testing anyway, so things could improve dramatically by November / December when the first chips are expected to ship to clients.